1. BGA (pob daim phiaj array)
Pob hu rau zaub, ib qho ntawm cov pob khoom ntog.Cov pob pob yog ua rau sab nraub qaum ntawm cov ntawv luam tawm los hloov cov pins raws li cov txheej txheem tso saib, thiab LSI nti tau sib sau ua ke rau pem hauv ntej ntawm cov ntawv sau substrate thiab tom qab ntawd kaw nrog molded resin lossis potting method.Qhov no kuj tseem hu ua lub pob zaub nqa khoom (PAC).Pins tuaj yeem tshaj 200 thiab yog ib hom pob siv rau ntau tus pin LSIs.Lub cev pob kuj tuaj yeem ua kom me dua li QFP (quad side pin flat pob).Piv txwv li, 360-pin BGA nrog 1.5mm tus pin chaw tsuas yog 31mm square, thaum 304-pin QFP nrog 0.5mm tus pin chaw yog 40mm square.Thiab BGA tsis tas yuav txhawj txog tus pin deformation zoo li QFP.Lub pob tau tsim los ntawm Motorola hauv Tebchaws Meskas thiab tau txais thawj zaug hauv cov khoom siv xws li cov xov tooj txawb, thiab zoo li yuav nrov hauv Tebchaws Meskas rau cov khoos phis tawj ntawm tus kheej yav tom ntej.Thaum pib, tus pin (bump) qhov nruab nrab ntawm BGA yog 1.5 hli thiab tus lej pins yog 225. 500-pin BGA kuj tau tsim los ntawm qee cov tuam txhab LSI.Qhov teeb meem ntawm BGA yog qhov kev tshuaj ntsuam xyuas tom qab rov ua dua.
2. BQFP (quad tiaj pob nrog bumper)
Ib pob quad tiaj tiaj nrog lub bumper, ib qho ntawm QFP pob, muaj pob (bumper) ntawm plaub fab ntawm lub pob lub cev kom tiv thaiv kev khoov ntawm tus pins thaum thauj khoom.US semiconductor manufacturers siv cov pob no feem ntau hauv circuits xws li microprocessors thiab ASICs.Pin center nrug 0.635mm, tus naj npawb ntawm pins ntawm 84 mus rau 196 los yog li ntawd.
3. Cov pob qij txha PGA (lub taub qab sib koom tes tus pin daim phiaj array) Alias ntawm nto mount PGA.
4. C-(ceramic)
Lub cim ntawm pob zeb ceramic.Piv txwv li, CDIP txhais tau hais tias ceramic DIP, uas feem ntau siv hauv kev xyaum.
5. Cerdip
Ceramic ob chav nyob rau hauv kab ntim nrog iav, siv rau ECL RAM, DSP (Digital Signal Processor) thiab lwm yam circuits.Cerdip nrog iav qhov rais yog siv rau UV erasure hom EPROM thiab microcomputer circuits nrog EPROM sab hauv.Tus pin center nrug yog 2.54mm thiab tus naj npawb ntawm tus pin yog los ntawm 8 mus rau 42.
6. Cerquad
Ib qho ntawm cov pob khoom ntog, cov ceramic QFP nrog underseal, yog siv los ntim cov logic LSI circuits xws li DSPs.Cerquad nrog lub qhov rais yog siv los ntim EPROM circuits.Thaum tshav kub kub dissipation yog zoo dua li yas QFPs, cia 1.5 mus rau 2W ntawm lub hwj chim nyob rau hauv tej yam ntuj tso cua txias.Txawm li cas los xij, tus nqi pob yog 3 mus rau 5 npaug ntau dua li cov yas QFPs.Pin center nrug yog 1.27mm, 0.8mm, 0.65mm, 0.5mm, 0.4mm, thiab lwm yam. Cov naj npawb ntawm cov pins nyob ntawm 32 txog 368.
7. CLCC (ceramic leaded nti carrier)
Ceramic leaded nti carrier nrog pins, ib qho ntawm cov pob mount nto, cov pins yog coj los ntawm plaub sab ntawm pob, nyob rau hauv cov duab ntawm ib tug ding.Nrog lub qhov rais rau pob ntawm UV erasure hom EPROM thiab microcomputer Circuit Court nrog EPROM, thiab lwm yam .. Cov pob no kuj hu ua QFJ, QFJ-G.
8. COB (chip on board)
Chip on board pob yog ib qho ntawm cov liab qab nti mounting thev naus laus zis, semiconductor nti yog mounted rau ntawm lub rooj tsavxwm luam tawm, kev sib txuas hluav taws xob ntawm nti thiab substrate tau paub los ntawm txoj kev siv lead ua stitching, hluav taws xob kev sib txuas ntawm nti thiab substrate yog pom tau los ntawm txoj kev siv lead ua stitching. , thiab nws yog them nrog resin kom ntseeg tau.Txawm hais tias COB yog qhov yooj yim tshaj plaws liab qab nti mounting thev naus laus zis, tab sis nws cov pob ceev yog qhov qis dua rau TAB thiab inverted nti soldering tshuab.
9. DFP (dual flat pob)
Muab ob npaug rau sab pin tiaj pob.Nws yog lub npe hu ua SOP.
10. DIC (dual in-line ceramic pob)
Ceramic DIP (nrog iav foob) alias.
11. DIL (dual in-line)
DIP alias (saib DIP).European semiconductor manufacturers feem ntau siv lub npe no.
12. DIP (dual in-line pob)
Muab ob npaug rau hauv-kab pob.Ib qho ntawm cov pob cartridge, cov pins yog coj los ntawm ob sab ntawm lub pob, cov khoom siv pob muaj ob hom yas thiab ceramic.DIP yog cov pob cartridge nrov tshaj plaws, cov ntawv thov suav nrog cov qauv logic IC, nco LSI, microcomputer circuits, thiab lwm yam.. Cov pin center nrug yog 2.54mm thiab cov naj npawb ntawm cov pins nyob ntawm 6 txog 64. lub pob dav feem ntau yog 15.2mm.qee cov pob khoom nrog qhov dav ntawm 7.52mm thiab 10.16mm yog hu ua tawv DIP thiab slim DIP feem.Tsis tas li ntawd, ceramic DIPs kaw nrog qis melting point iav kuj hu ua cerdip (saib cerdip).
13. DSO (dual me me out-lint)
Ib lub npe rau SOP (saib SOP).Qee lub tuam txhab semiconductor siv lub npe no.
14. DICP (dual tape carrier pob)
Ib qho ntawm TCP (kab kab xev thauj khoom pob).Cov pins yog tsim los ntawm ib daim kab xev insulating thiab coj tawm ntawm ob sab ntawm pob.Vim yog siv TAB (automatic daim kab xev cab kuj soldering) tshuab, pob profile yog nyias heev.Nws yog feem ntau siv rau LCD tsav LSIs, tab sis feem ntau ntawm lawv yog kev cai tsim.Ntxiv rau, 0.5mm tuab nco LSI phau ntawv pob yog nyob rau hauv kev txhim kho.Hauv Nyij Pooj, DICP yog lub npe DTP raws li EIAJ (Electronic Industries and Machinery of Japan) tus qauv.
15. DIP (dual tape carrier pob)
Ib yam li saum toj no.Lub npe ntawm DTCP hauv EIAJ tus qauv.
16. FP (dawb pob)
Pav pob.Ib lub npe hu ua QFP lossis SOP (saib QFP thiab SOP).Qee lub tuam txhab semiconductor siv lub npe no.
17. flip-chip
Flip-chip.Ib qho ntawm cov txheej txheem ntim khoom ntim khoom uas lub pob hlau yog tsim nyob rau hauv qhov chaw electrode ntawm LSI nti thiab tom qab ntawd cov hlau pob yog siab-soldered rau thaj tsam electrode ntawm cov ntawv luam tawm.Qhov chaw nyob ntawm lub pob yog qhov pib zoo ib yam li qhov loj ntawm cov nti.Nws yog qhov tsawg tshaj plaws thiab thinnest ntawm tag nrho cov ntim tshuab.Txawm li cas los xij, yog tias cov coefficient ntawm thermal expansion ntawm lub substrate txawv ntawm LSI nti, nws tuaj yeem hnov mob ntawm qhov sib koom ua ke thiab yog li cuam tshuam rau kev ntseeg siab ntawm kev sib txuas.Yog li, nws yog ib qho tsim nyog los txhawb LSI nti nrog cob thiab siv cov khoom siv substrate nrog kwv yees li tib coefficient ntawm thermal expansion.
18. FQFP (zoo suab quad tiaj pob)
QFP nrog tus pin me me nyob deb, feem ntau tsawg dua 0.65mm (saib QFP).Qee tus neeg tsim khoom siv lub npe no.
19. CPAC (lub ntiaj teb sab saum toj ncoo array carrier)
Motorola lub npe hu ua BGA.
20. CQFP (quad fiat pob nrog tus neeg zov lub nplhaib)
Quad fiat pob nrog lub nplhaib tiv thaiv.Ib qho ntawm cov yas QFPs, cov pins tau npog nrog lub nplhaib tiv thaiv kom tiv thaiv kev khoov thiab deformation.Ua ntej sib sau ua ke LSI ntawm cov ntawv luam tawm, cov pins raug txiav los ntawm lub nplhaib tiv thaiv thiab ua rau hauv lub seagull tis duab (L-zoo).Cov pob no yog nyob rau hauv ntau lawm ntawm Motorola, USA.Tus pin center nrug yog 0.5 hli, thiab ntau tus pins yog hais txog 208.
21. H-(nrog lub dab dej kub)
Qhia ib lub cim nrog lub dab dej kub.Piv txwv li, HSOP qhia SOP nrog lub dab dej kub.
22. tus pin grid array (nto mount hom)
Qhov saum npoo mount hom PGA feem ntau yog lub thawv ntim ntim nrog tus pin ntev li ntawm 3.4mm, thiab qhov chaw mount hom PGA muaj cov duab ntawm tus pins nyob rau sab hauv qab ntawm pob nrog qhov ntev ntawm 1.5mm txog 2.0mm.Txij li thaum tus pin chaw nyob deb tsuas yog 1.27 hli, uas yog ib nrab ntawm qhov loj ntawm cov cartridge hom PGA, lub pob lub cev tuaj yeem ua kom me me, thiab tus naj npawb ntawm cov pins yog ntau dua li ntawm hom cartridge (250-528), yog li nws yog lub pob siv rau cov logic loj LSI.Cov pob substrates yog multilayer ceramic substrates thiab iav epoxy resin luam ntawv substrates.Kev tsim cov pob khoom nrog multilayer ceramic substrates tau dhau los ua tswv yim.
23. JLCC (J-leaded nti cab kuj)
J-zoo li tus pin chip carrier.Hais txog lub qhov rais CLCC thiab cov qhov rai ceramic QFJ alias (saib CLCC thiab QFJ).Qee lub tuam txhab semi-conductor siv lub npe.
24. LCC (Leadless nti cab kuj)
Pinless chip cab kuj.Nws yog hais txog lub pob nto mount nyob rau hauv uas tsuas yog cov electrodes ntawm plaub sab ntawm ceramic substrate nyob rau hauv kev sib cuag tsis muaj pins.High-speed thiab high-frequency IC pob, tseem hu ua ceramic QFN los yog QFN-C.
25. LGA (daim phiaj array)
Tiv tauj zaub pob.Nws yog ib pob uas muaj array ntawm kev sib cuag ntawm sab hauv qab.Thaum sib dhos, nws tuaj yeem muab tso rau hauv lub qhov (socket).Muaj 227 tus neeg (1.27mm centre nrug) thiab 447 hu (2.54mm centre nrug) ntawm ceramic LGAs, uas yog siv nyob rau hauv high-speed logic LSI circuits.LGAs tuaj yeem ua kom haum ntau lub tswv yim thiab tso tawm tus pins hauv pob me dua QFPs.Tsis tas li ntawd, vim qhov tsis kam ntawm cov hlau lead, nws tsim nyog rau kev kub ceev LSI.Txawm li cas los xij, vim qhov nyuaj thiab tus nqi siab ntawm kev tsim cov qhov (socket), lawv tsis siv ntau tam sim no.Qhov kev thov rau lawv xav tias yuav nce ntxiv rau yav tom ntej.
26. LOC (ua rau ntawm nti)
LSI ntim tshuab yog ib qho qauv uas nyob rau hauv pem hauv ntej kawg ntawm cov hlau lead thav duab yog saum toj no lub nti thiab ib tug bumpy solder sib koom ua ke yog ua nyob rau hauv lub nruab nrab ntawm lub nti, thiab cov hluav taws xob kev twb kev txuas yog tsim los ntawm stitching cov coj ua ke.Piv nrog rau cov qauv qub uas cov hlau lead yog muab tso rau ze ntawm sab ntawm lub nti, cov nti tuaj yeem nyob hauv tib lub pob loj nrog qhov dav ntawm li 1 hli.
27. LQFP (tsawg profile quad tiaj pob)
Nyias QFP yog hais txog QFPs nrog lub pob lub cev tuab ntawm 1.4mm, thiab yog lub npe siv los ntawm Nyiv Electronics Machinery Industry Association raws li QFP daim ntawv tshiab tshwj xeeb.
28. L-QUA
Ib qho ntawm cov ceramic QFPs.Aluminium nitride yog siv rau lub pob substrate, thiab thermal conductivity ntawm lub hauv paus yog 7 mus rau 8 lub sij hawm siab dua li ntawm txhuas oxide, muab cov cua kub zoo dua.Lub thav duab ntawm lub pob yog ua los ntawm txhuas oxide, thiab cov nti yog kaw los ntawm potting txoj kev, yog li suppressing tus nqi.Nws yog ib pob tsim rau logic LSI thiab tuaj yeem ua raws li W3 lub zog nyob rau hauv cov huab cua txias.Lub 208-pin (0.5mm nruab nrab suab) thiab 160-pin (0.65mm nruab nrab suab) pob rau LSI logic tau tsim thiab muab tso rau hauv ntau lawm thaum Lub Kaum Hli 1993.
29. MCM (multi-chip module)
Multi-chip module.Ib pob uas muaj ntau yam semiconductor liab qab chips tau sib sau ua ke ntawm cov kab hluav taws xob substrate.Raws li cov khoom siv substrate, nws tuaj yeem muab faib ua peb pawg, MCM-L, MCM-C thiab MCM-D.MCM-L yog ib qho kev sib dhos uas siv cov iav epoxy resin ib txwm muaj ntau txheej luam ntawv substrate.Nws yog tsawg ntom thiab tsis tshua muaj nqi.MCM-C yog ib qho khoom siv uas siv cov cuab yeej ua yeeb yaj kiab tuab los tsim cov txheej txheem sib txuas nrog cov khoom siv hluav taws xob (alumina lossis iav-ceramic) ua cov substrate, zoo ib yam li cov yeeb yaj kiab tuab hybrid ICs siv ntau txheej txheej ceramic substrates.Tsis muaj qhov sib txawv tseem ceeb ntawm ob.Cov xov hlau ceev yog siab dua li ntawm MCM-L.
MCM-D yog ib qho khoom siv uas siv cov tshuab ua yeeb yaj kiab nyias los tsim cov txheej txheem sib txuas nrog cov ceramic (alumina lossis aluminium nitride) lossis Si thiab Al ua substrates.Cov xov hlau ceev yog qhov siab tshaj ntawm peb hom ntawm cov khoom, tab sis tus nqi kuj yog siab.
30. MFP (mini ca pob)
Cov pob me me.Ib lub npe rau cov yas SOP lossis SSOP (saib SOP thiab SSOP).Lub npe siv los ntawm qee cov tuam txhab semiconductor.
31. MQFP (metric quad tiaj pob)
Kev faib tawm ntawm QFPs raws li JEDEC (Joint Electronic Devices Committee) tus qauv.Nws hais txog tus qauv QFP nrog tus pin nruab nrab ntawm 0.65mm thiab lub cev tuab ntawm 3.8mm txog 2.0mm (saib QFP).
32. MQUAD(hlau quad)
Ib pob QFP tsim los ntawm Olin, Tebchaws Asmeskas.Lub hauv paus phaj thiab npog yog ua los ntawm aluminium thiab kaw nrog nplaum.Nws tuaj yeem tso cai 2.5W ~ 2.8W ntawm lub zog nyob rau hauv cov huab cua txias.Nippon Shinko Kogyo tau tso cai los pib tsim khoom hauv xyoo 1993.
33. MSP (mini square pob)
QFI alias (saib QFI), nyob rau theem pib ntawm txoj kev loj hlob, feem ntau hu ua MSP, QFI yog lub npe sau los ntawm Nyiv Electronics Machinery Industry Association.
34. OPMAC (dhau molded pad array carrier)
Moulded resin sealing pob zaub nqa.Lub npe siv los ntawm Motorola rau molded resin sealing BGA (saib BGA).
35. P-(yas)
Qhia qhov cim ntawm pob yas.Piv txwv li, PDIP txhais tau tias yas DIP.
36. PAC (pad array carrier)
Cov khoom thauj khoom, lub npe ntawm BGA (saib BGA).
37. PCLP (cov ntawv luam tawm Circuit Board leadless pob)
Printed circuit board leadless pob.Pin center nrug muaj ob qhov tshwj xeeb: 0.55mm thiab 0.4mm.Tam sim no nyob rau theem kev loj hlob.
38. PFPF (cov hnab yas tiaj tus)
Cov hnab yas tiaj tus.Alias rau yas QFP (saib QFP).Qee lub tuam txhab LSI siv lub npe.
39. PGA (pin grid array)
Pin array pob.Ib qho ntawm cov pob ntawv hom cartridge uas cov pins ntsug ntawm sab hauv qab yog teem rau hauv cov qauv duab.Yeej, multilayer ceramic substrates yog siv rau pob substrate.Nyob rau hauv rooj plaub uas cov khoom npe tsis qhia tshwj xeeb, feem ntau yog ceramic PGAs, uas yog siv rau high-speed, loj-scale logic LSI circuits.Tus nqi yog siab.Pin chaw nruab nrab feem ntau yog 2.54 hli sib nrug thiab tus lej suav txij li 64 txog 447. Txhawm rau txo tus nqi, cov pob substrate tuaj yeem hloov los ntawm iav epoxy luam ntawv substrate.Yas PG A nrog 64 rau 256 tus pins kuj muaj.Kuj tseem muaj tus pin luv luv nto mount hom PGA (kov-solder PGA) nrog tus pin nruab nrab ntawm 1.27mm.(Saib nto mount hom PGA).
40. Pig rov qab
Ntim pob.Ib pob ceramic nrog lub qhov (socket), zoo ib yam li DIP, QFP, lossis QFN.Siv rau hauv kev tsim cov khoom siv nrog microcomputers los ntsuas kev ua haujlwm pov thawj kev ua haujlwm.Piv txwv li, EPROM tau muab tso rau hauv lub qhov (socket) rau kev debugging.Cov pob no yog ib qho khoom siv kev cai thiab tsis muaj nyob hauv khw.
Post lub sij hawm: May-27-2022