Txhawm rau ua kom tau raws li qhov xav tau thermal ntawm daim ntawv thov, cov neeg tsim qauv yuav tsum sib piv cov yam ntxwv thermal ntawm ntau hom pob semiconductor.Hauv tsab xov xwm no, Nexperia tham txog cov txheej txheem thermal ntawm nws cov pob khoom siv hlau thiab cov pob nyiaj chip kom cov neeg tsim khoom tuaj yeem xaiv cov pob tsim nyog dua.
Yuav ua li cas Thermal conduction yog ua tiav nyob rau hauv Hlau Bonded Devices
Lub hauv paus cua kub dab dej hauv cov khoom siv hlau sib txuas yog los ntawm qhov sib txuas siv taw tes rau cov pob qij txha ntawm cov ntawv luam tawm Circuit Board (PCB), raws li qhia hauv daim duab 1. Ua raws li qhov yooj yim algorithm ntawm thawj qhov kev txiav txim kwv yees, qhov cuam tshuam ntawm lub zog thib ob. noj channel (pom nyob rau hauv daim duab) yog negligible nyob rau hauv lub thermal kuj xam.
Thermal channels hauv cov khoom siv hlau sib txuas
Dual thermal conduction raws hauv SMD ntaus ntawv
Qhov txawv ntawm ib pob SMD thiab ib lub pob hlau sib txuas raws li cov cua sov dissipation yog tias cov cua sov los ntawm kev sib tshuam ntawm cov cuab yeej tuaj yeem tawg tau raws li ob txoj kev sib txawv, piv txwv li, los ntawm cov hlau lead (xws li hauv cov ntaub ntawv xov hlau sib txuas) thiab los ntawm tus ncej clip.
Thaum tshav kub kub hloov mus rau hauv ib lub chip bonded pob
Lub ntsiab lus ntawm cov thermal tsis kam ntawm kev sib txuas mus rau qhov sib koom ua ke Rth (j-sp) yog qhov nyuaj ntxiv los ntawm qhov muaj ob qhov kev siv cov pob qij txha.Cov ntsiab lus siv no yuav muaj qhov sib txawv ntawm qhov kub thiab txias, ua rau lub thermal tsis kam ua ib qho kev sib txuas sib txuas.
Nexperia siv tib txoj kev los rho tawm tus nqi Rth (j-sp) rau ob qho tib si chip-bonded thiab hlau-soldered li.Tus nqi no qhia txog txoj hauv kev thermal tseem ceeb los ntawm cov nti mus rau cov hlau lead mus rau cov pob qij txha, ua rau cov txiaj ntsig ntawm cov khoom siv chip-bonded zoo ib yam li cov txiaj ntsig rau cov khoom siv hlau-soldered hauv cov txheej txheem PCB zoo sib xws.Txawm li cas los xij, qhov thib ob channel tsis tau siv tag nrho thaum rho tawm tus nqi Rth (j-sp), yog li tag nrho cov thermal peev xwm ntawm cov cuab yeej feem ntau yog siab dua.
Qhov tseeb, qhov thib ob tseem ceeb ntawm lub dab dej kub channel muab sijhawm rau cov neeg tsim qauv los txhim kho PCB tsim.Piv txwv li, rau cov khoom siv hlau-soldered, cua sov tuaj yeem tsuas yog dissipated los ntawm ib qho channel (feem ntau ntawm cov cua sov ntawm diode yog dissipated los ntawm tus pin cathode);rau cov cuab yeej clip-bonded, cua sov tuaj yeem dissipated ntawm ob lub terminals.
Simulation ntawm Thermal Performance of Semiconductor Devices
Kev simulation simulation tau pom tias thermal kev ua tau zoo tuaj yeem txhim kho tau zoo yog tias txhua lub tshuab hluav taws xob ntawm PCB muaj cov txheej txheem thermal.Piv txwv li, nyob rau hauv CFP5-pob PMEG6030ELP diode (Daim duab 3), 35% ntawm cov cua sov yog pauv mus rau lub anode pins los ntawm cov tooj liab clamps thiab 65% yog pauv mus rau cathode pins los ntawm cov leadframes.
CFP5 ntim diode
"Cov kev sim simulation tau lees paub tias kev faib cov dab dej kub hauv ob feem (raws li qhia hauv daim duab 4) yog qhov tsim nyog rau cov cua sov dissipation.
Yog tias 1 cm² heatsink raug faib ua ob 0.5 cm² heatsinks muab tso rau hauv qab ntawm txhua qhov ntawm ob lub terminals, tus nqi hluav taws xob tuaj yeem cuam tshuam los ntawm diode ntawm tib qhov kub thiab txias nce 6%.
Ob lub 3 cm² heatsinks nce lub zog dissipation li ntawm 20 feem pua piv rau tus qauv tsim hluav taws xob los yog 6 cm² heatsink txuas rau ntawm cathode. "
Thermal Simulation tshwm sim nrog cov dab dej kub hauv ntau qhov chaw thiab cov chaw ua haujlwm
Nexperia pab cov neeg tsim qauv xaiv cov pob khoom zoo dua rau lawv cov ntawv thov
Qee cov khoom siv hluav taws xob semiconductor tsis muab cov neeg tsim qauv nrog cov ntaub ntawv tsim nyog los txiav txim siab hom pob twg yuav muab kev ua haujlwm zoo dua thermal rau lawv daim ntawv thov.Hauv tsab xov xwm no, Nexperia piav qhia txog cov txheej txheem thermal hauv nws cov hlau sib txuas thiab cov khoom siv chip sib txuas los pab cov neeg tsim qauv txiav txim siab zoo dua rau lawv cov ntawv thov.
Cov lus qhia ceev ceev txog NeoDen
① Tsim los ntawm 2010, 200+ tus neeg ua haujlwm, 8000+ Sq.m.Hoobkas
② NeoDen khoom: Ntse series PNP tshuab, NeoDen K1830, NeoDen4, NeoDen3V, NeoDen7, NeoDen6, TM220A, TM240A, TM245P, reflow cub IN6, IN12, Solder paste tshuab luam ntawv FP30406 PM,
③ Ua tiav 10000+ cov neeg siv khoom thoob plaws ntiaj teb
④ 30+ Cov Neeg Sawv Cev Thoob Ntiaj Teb tau them rau hauv Asia, Europe, America, Oceania thiab Africa
⑤ R&D Center: 3 R&D chav haujlwm nrog 25+ tus kws tshaj lij R&D engineers
⑥ Sau nrog CE thiab tau txais 50+ patents
⑦ 30+ kev tswj xyuas zoo thiab kev txhawb nqa engineers, 15+ tus neeg laus muag khoom thoob ntiaj teb, raws sijhawm cov neeg siv khoom teb tsis pub dhau 8 teev, kev daws teeb meem muab hauv 24 teev
Post lub sij hawm: Sep-13-2023