Ntau ntau yam ntawm cov substrates siv rau PCBs, tab sis dav muab faib ua ob pawg, uas yog cov ntaub ntawv inorganic substrate thiab cov ntaub ntawv organic substrate.
Cov ntaub ntawv inorganic substrate
Inorganic substrate feem ntau yog ceramic daim hlau, ceramic circuit substrate khoom yog 96% alumina, nyob rau hauv cov ntaub ntawv ntawm yuav tsum tau ib tug siab zog substrate, 99% ntshiab alumina cov ntaub ntawv yuav siv tau tab sis high-purity alumina ua nyuaj, cov tawm los yog tsawg, yog li cov siv cov ntshiab alumina nqi yog siab.Beryllium oxide kuj yog cov khoom siv ntawm ceramic substrate, nws yog hlau oxide, muaj hluav taws xob rwb thaiv tsev zoo thiab thermal conductivity zoo heev, tuaj yeem siv los ua cov substrate rau cov hluav taws xob muaj hluav taws xob ntau.
Ceramic Circuit Court substrates yog tsuas yog siv nyob rau hauv tuab thiab nyias zaj duab xis hybrid integrated circuits, multi-chip micro-assembly circuits, uas muaj qhov zoo ntawm cov khoom siv organic Circuit Court substrates tsis sib xws.Piv txwv li, CTE ntawm cov ceramic substrate tuaj yeem phim CTE ntawm LCCC vaj tse, yog li kev sib koom ua ke zoo yuav tau txais thaum sib dhos LCCC li.Tsis tas li ntawd, ceramic substrates yog haum rau lub tshuab nqus tsev evaporation txheej txheem nyob rau hauv chip manufacturing vim lawv tsis emit ib tug loj npaum li cas ntawm adsorbed gases uas ua rau ib tug txo nyob rau hauv lub nqus tsev vacuum theem txawm thaum rhuab.Tsis tas li ntawd, ceramic substrates kuj muaj qhov kub thiab txias tsis kam, zoo nto tiav, muaj tshuaj lom neeg ruaj khov, yog qhov nyiam tshaj plaws Circuit Court substrate rau tuab thiab nyias zaj duab xis hybrid circuits thiab multi-chip micro-assembly circuits.Txawm li cas los xij, nws yog qhov nyuaj rau kev ua tiav rau hauv qhov loj thiab tiaj tus substrate, thiab tsis tuaj yeem ua rau ntau qhov sib xyaw ua ke thwj board qauv kom tau raws li qhov xav tau ntawm cov khoom siv hluav taws xob tas li, vim qhov loj dielectric tas li ntawm cov khoom siv ceramic, yog li nws. kuj tsis haum rau high-speed circuit substrates, thiab tus nqi kuj yog siab heev.
Cov khoom siv organic substrate
Organic substrate cov ntaub ntawv yog ua los ntawm cov ntaub ntawv reinforcing xws li iav fiber ntau daim ntaub (fiber ntawv, iav lev, thiab lwm yam), impregnated nrog resin binder, qhuav rau hauv ib tug dawb paug, ces them nrog tooj liab ntawv ci, thiab ua los ntawm kub thiab siab.Hom substrate no hu ua tooj liab-clad laminate (CCL), feem ntau hu ua tooj liab-clad panels, yog cov khoom tseem ceeb rau kev tsim PCBs.
CCL ntau ntau yam, yog tias cov khoom siv txhawb zog siv los faib, tuaj yeem muab faib ua cov ntawv raws li, iav fiber ntau daim ntaub-based, composite puag (CEM) thiab hlau-raws li plaub pawg;Raws li cov organic resin binder siv los faib, thiab tuaj yeem muab faib ua phenolic resin (PE) epoxy resin (EP), polyimide resin (PI), polytetrafluoroethylene resin (TF) thiab polyphenylene ether resin (PPO);Yog hais tias lub substrate yog nruj thiab hloov tau los faib, thiab tuaj yeem muab faib ua nruj CCL thiab hloov tau yooj yim CCL.
Tam sim no dav siv nyob rau hauv kev tsim ntawm ob tog PCB yog epoxy iav fiber ntau Circuit Court substrate, uas combines qhov zoo ntawm lub zog zoo ntawm iav fiber ntau thiab epoxy resin toughness, nrog zoo zog thiab ductility.
Epoxy iav fiber ntau Circuit Court substrate yog tsim los ntawm thawj infiltrating epoxy resin rau hauv iav fiber ntau daim ntaub los ua lub laminate.Nyob rau tib lub sijhawm, lwm yam tshuaj ntxiv, xws li cov tshuaj tua kab mob, cov tshuaj stabilizers, cov tshuaj tiv thaiv kab mob, cov nplaum, thiab lwm yam. Ces tooj liab ntawv ci yog glued thiab nias rau ntawm ib los yog ob sab ntawm lub laminate los ua ib tug tooj liab-clad epoxy iav fiber ntau. laminate.Nws tuaj yeem siv los ua ntau yam ib leeg, ob sab thiab ntau txheej PCBs.
Post lub sij hawm: Mar-04-2022