I. BGA ntim yog cov txheej txheem ntim nrog cov kev xav tau siab tshaj plaws hauv kev tsim PCB.Nws qhov zoo yog raws li nram no:
1. Tus pin luv, qis sib dhos qhov siab, me me parasitic inductance thiab capacitance, kev ua tau zoo ntawm hluav taws xob.
2. Kev sib koom ua ke siab heev, ntau tus pins, tus pin loj sib nrug, zoo tus pin coplanar.Qhov txwv ntawm tus pin sib nrug ntawm QFP electrode yog 0.3mm.Thaum sib sau ua ke cov welded Circuit Court board, mounting raug ntawm QFP nti yog nruj heev.Kev ntseeg tau ntawm kev sib txuas hluav taws xob yuav tsum tau ua kom lub siab ntev ntawm 0.08mm.QFP electrode pins nrog qhov nrug nqaim yog nyias thiab tsis yooj yim, yooj yim rau ntswj lossis tawg, uas yuav tsum tau ua kom muaj kev sib luag thiab kev sib luag ntawm lub rooj tsav xwm hauv Circuit Court pins yuav tsum tau lav.Hauv qhov sib piv, qhov zoo tshaj plaws ntawm BGA pob yog tias 10-electrode tus pin sib nrug yog qhov loj, qhov sib txawv yog 1.0mm.1.27mm, 1.5mm (Inch 40mil, 50mil, 60mil), mounting kam rau ua yog 0.3mm, nrog ntau yam zoo tib yam. - ua haujlwmSMT tshuabthiabreflow qhov cubtuaj yeem ua tau raws li qhov yuav tsum tau ua ntawm BGA sib dhos.
II.Thaum BGA encapsulation muaj qhov zoo saum toj no, nws kuj muaj cov teeb meem hauv qab no.Cov hauv qab no yog qhov tsis zoo ntawm BGA encapsulation:
1. Nws yog ib qho nyuaj rau kev soj ntsuam thiab tswj BGA tom qab vuam.PCB cov tuam txhab yuav tsum siv X-ray fluoroscopy lossis X-ray txheej tshuaj xyuas kom ntseeg tau qhov kev ntseeg siab ntawm lub rooj tsavxwm vuam kev sib txuas, thiab cov khoom siv raug nqi siab.
2. Ib tus neeg cov pob qij txha ntawm lub rooj tsavxwm tau tawg, yog li tag nrho cov khoom yuav tsum raug tshem tawm, thiab cov BGA tshem tawm tsis tuaj yeem rov qab siv dua.
Post lub sij hawm: Lub Xya hli ntuj-20-2021