HDI Circuit Board yog dab tsi?

I. HDI board yog dab tsi?

HDI pawg thawj coj saib (High Density Interconnector), uas yog, high-density interconnect board, yog siv cov micro-dig muag faus qhov tshuab, ib lub rooj tsav xwm Circuit Court nrog ib tug kuj siab ceev ntawm kab tis.HDI board muaj ib txoj kab sab hauv thiab sab nrauv, thiab tom qab ntawd siv cov drilling, qhov metallization thiab lwm yam txheej txheem, kom txhua txheej ntawm cov kab hauv kev sib txuas.

II.Qhov txawv ntawm HDI board thiab zoo tib yam PCB

HDI pawg thawj coj saib feem ntau yog tsim los siv cov txheej txheem tsub zuj zuj, ntau txheej txheej, siab dua cov qib technical ntawm lub rooj tsavxwm.Lub Rooj Tswjhwm Saib HDI yog qhov pib 1 lub sij hawm laminated, qib siab HDI siv 2 los yog ntau tshaj lub sij hawm lamination tshuab, thaum siv cov stacked qhov, plating filling qhov, laser direct xuas nrig ntaus thiab lwm yam advanced PCB technology.Thaum qhov ceev ntawm PCB nce ntau tshaj li yim-txheej pawg thawj coj saib, tus nqi ntawm kev tsim khoom nrog HDI yuav qis dua li cov txheej txheem xovxwm nyuaj.

Kev ua tau zoo ntawm hluav taws xob thiab teeb liab raug ntawm HDI boards siab dua li cov PCBs ib txwm muaj.Tsis tas li ntawd, HDI boards muaj kev txhim kho zoo dua rau RFI, EMI, static paug, thermal conductivity, thiab lwm yam. High Density Integration (HDI) technology tuaj yeem ua rau cov khoom kawg tsim ntau me me, thaum ua tau raws cov qauv siab dua ntawm kev ua haujlwm hluav taws xob thiab kev ua haujlwm zoo.

III.cov ntaub ntawv HDI board

HDI PCB cov ntaub ntawv tau muab tso rau hauv qee qhov kev xav tau tshiab, suav nrog kev ruaj ntseg zoo dua, tiv thaiv zoo li qub thiab tsis muaj nplaum.Cov ntaub ntawv raug rau HDI PCB yog RCC (resin-coated tooj liab).muaj peb hom RCC, uas yog polyimide metalized zaj duab xis, ntshiab polyimide zaj duab xis, thiab cam khwb cia polyimide zaj duab xis.

Qhov zoo ntawm RCC muaj xws li: me me thickness, lub teeb yuag, yooj thiab flammability, compatibility yam ntxwv impedance thiab zoo heev seem stability.Nyob rau hauv tus txheej txheem ntawm HDI multilayer PCB, es tsis txhob ntawm cov tsoos daim ntawv cog lus thiab tooj liab ntawv ci raws li ib tug insulating nruab nrab thiab conductive txheej, RCC tuaj yeem raug tshem tawm los ntawm cov txheej txheem kev sib tsoo nrog cov chips.Tsis siv neeg tshuab drilling txoj kev xws li laser yog ces siv nyob rau hauv thiaj li yuav tsim micro-los ntawm-qhov interconnections.

RCC tsav qhov tshwm sim thiab kev loj hlob ntawm PCB cov khoom los ntawm SMT (Nto Mount Technology) mus rau CSP (Chip Level Ntim), los ntawm cov neeg kho tshuab drilling mus rau laser drilling, thiab txhawb txoj kev loj hlob thiab kev loj hlob ntawm PCB microvia, tag nrho cov no yog cov HDI PCB khoom. rau RCC.

Hauv qhov tseeb PCB hauv cov txheej txheem tsim khoom, rau kev xaiv ntawm RCC, feem ntau yog FR-4 tus qauv Tg 140C, FR-4 siab Tg 170C thiab FR-4 thiab Rogers ua ke laminate, uas feem ntau siv niaj hnub no.Nrog rau kev txhim kho ntawm HDI thev naus laus zis, HDI PCB cov ntaub ntawv yuav tsum ua kom tau raws li qhov xav tau ntau dua, yog li cov qauv tseem ceeb ntawm HDI PCB cov ntaub ntawv yuav tsum yog

1. Kev txhim kho thiab kev siv cov khoom siv tau yooj yim siv tsis muaj cov nplaum nplaum

2. Me me dielectric txheej thickness thiab me me sib txawv

3.kev txhim kho ntawm LPIC

4. Me thiab me dielectric qhov tsis tu ncua

5. Me thiab me dielectric poob

6. High solder stability

7. nruj me ntsis sib xws nrog CTE (coefficient ntawm thermal expansion)

IV.daim ntawv thov ntawm HDI board manufacturing technology

Qhov nyuaj ntawm HDI PCB manufacturing yog micro los ntawm kev tsim khoom, los ntawm metallization thiab cov kab zoo.

1. Micro-dhau-qhov chaw tsim khoom

Micro-los ntawm-qhov kev tsim khoom yog qhov teeb meem tseem ceeb ntawm HDI PCB kev tsim khoom.Muaj ob txoj hauv kev tseem ceeb drilling.

ib.Rau kev sib tsoo los ntawm qhov drilling, mechanical drilling yog ib qho kev xaiv zoo tshaj plaws rau nws cov kev ua haujlwm siab thiab tus nqi qis.Nrog rau txoj kev loj hlob ntawm cov neeg kho tshuab machining muaj peev xwm, nws daim ntawv thov nyob rau hauv micro-los ntawm-qhov yog kuj evolving.

b.Muaj ob hom laser drilling: photothermal ablation thiab photochemical ablation.Cov qub hais txog cov txheej txheem ntawm cov cua sov cov khoom siv ua haujlwm kom yaj nws thiab evaporate los ntawm lub qhov los ntawm qhov tsim tom qab lub zog nqus ntawm lub laser.Cov tom kawg yog hais txog qhov tshwm sim ntawm lub zog photons hauv cheeb tsam UV thiab laser ntev tshaj 400 nm.

Muaj peb hom laser tshuab siv rau cov khoom siv tau yooj yim thiab nruj, xws li excimer laser, UV laser drilling, thiab CO 2 laser.Laser tshuab tsis yog tsuas yog haum rau drilling, tab sis kuj rau txiav thiab sib sau.Txawm tias qee lub tuam txhab tsim HDI los ntawm laser, thiab txawm hais tias cov cuab yeej siv laser drilling yog tus nqi, lawv muaj ntau dua precision, ruaj khov txheej txheem thiab pov thawj technology.Qhov zoo ntawm laser thev naus laus zis ua rau nws txoj kev siv ntau tshaj plaws hauv qhov muag tsis pom / faus los ntawm qhov chaw tsim khoom.Niaj hnub no, 99% ntawm HDI microvia qhov tau txais los ntawm laser drilling.

2. Los ntawm metallization

Qhov teeb meem loj tshaj plaws nyob rau hauv lub qhov metallization yog qhov nyuaj hauv kev ua tiav cov txheej txheem plating.Rau qhov sib sib zog nqus plating tshuab ntawm micro-los ntawm qhov, ntxiv rau kev siv cov tshuaj plating nrog kev muaj peev xwm dispersion siab, cov txheej txheem plating ntawm cov cuab yeej plating yuav tsum tau kho dua tshiab hauv lub sijhawm, uas tuaj yeem ua tau los ntawm cov neeg kho tshuab muaj zog stirring lossis vibration, ultrasonic stirring, thiab kab rov tav txau.Tsis tas li ntawd, cov av noo ntawm phab ntsa ntawm lub qhov yuav tsum tau nce ntxiv ua ntej plating.

Ntxiv nrog rau cov txheej txheem kev txhim kho, HDI los ntawm lub qhov metallization txoj kev tau pom kev txhim kho hauv cov thev naus laus zis loj: chemical plating additive technology, direct plating technology, thiab lwm yam.

3. Cov kab zoo

Kev siv cov kab zoo suav nrog cov duab hloov pauv thiab ncaj qha laser duab.Cov duab hloov pauv yog tib yam li cov tshuaj etching zoo tib yam rau cov kab.

Rau laser direct imaging, tsis muaj yees duab yees duab yog yuav tsum tau, thiab cov duab yog tsim ncaj qha rau ntawm photosensitive zaj duab xis los ntawm laser.UV yoj lub teeb yog siv rau kev ua haujlwm, ua kom cov kua dej khaws cia kom tau raws li qhov xav tau ntawm kev daws teeb meem siab thiab ua haujlwm yooj yim.Tsis muaj cov duab thaij duab yuav tsum zam kom tsis txhob muaj qhov cuam tshuam tsis zoo vim yog cov yeeb yaj kiab tsis zoo, tso cai rau kev sib txuas ncaj qha rau CAD / CAM thiab ua kom luv luv ntawm kev tsim khoom, ua rau nws tsim nyog rau kev txwv thiab ntau ntau lawm.

Zhejiang NeoDen Technology Co., LTD., nrhiav tau nyob rau hauv 2010, yog ib lub chaw tsim khoom tshwj xeeb hauv SMT xaiv thiab qhov chaw tshuab,reflow qhov cub, stencil tshuab luam ntawv, SMT ntau lawm kab thiab lwm yamSMT cov khoom.Peb muaj peb tus kheej R & D pab neeg thiab tus kheej lub Hoobkas, ua kom zoo dua ntawm peb tus kheej nplua nuj kev paub R & D, kev cob qhia zoo, tau txais lub koob npe nrov los ntawm cov neeg siv khoom thoob ntiaj teb.

Hauv kaum xyoo no, peb tus kheej tsim NeoDen4, NeoDen IN6, NeoDen K1830, NeoDen FP2636 thiab lwm yam khoom siv SMT, uas muag zoo thoob plaws ntiaj teb.

Peb ntseeg tias cov neeg zoo thiab cov neeg koom tes ua rau NeoDen yog ib lub tuam txhab zoo thiab tias peb txoj kev cog lus rau Innovation, Diversity thiab Sustainability kom ntseeg tau tias SMT automation yog siv tau rau txhua tus neeg nyiam nyiam nyob txhua qhov chaw.