1. Cov txheej txheem sab yog tsim rau sab luv.
2. Cov khoom siv ntsia ze ntawm qhov sib txawv yuav raug puas tsuaj thaum lub rooj tsavxwm raug txiav.
3. PCB pawg thawj coj saib yog ua los ntawm TEFLON cov khoom nrog thickness ntawm 0.8 hli.Cov khoom yog mos thiab yooj yim rau deform.
4. PCB txais yuav V-txiav thiab ntev qhov txheej txheem tsim rau sab kis.Vim tias qhov dav ntawm qhov kev sib txuas tsuas yog 3 hli, thiab muaj qhov hnyav siv lead ua kev co, lub qhov (socket) thiab lwm yam khoom siv ntsaws rau ntawm lub rooj tsavxwm, PCB yuav tawg thaum lub sijhawm.reflow qhov cubvuam, thiab qee zaum qhov tshwm sim ntawm kev sib kis sab tawg tshwm sim thaum siv.
5. Lub thickness ntawm PCB board tsuas yog 1.6 hli.Heavy Cheebtsam xws li fais fab module thiab coil yog nteg nyob rau hauv nruab nrab ntawm qhov dav ntawm lub rooj tsavxwm.
6. PCB rau kev txhim kho BGA Cheebtsam txais Yin Yang board tsim.
ib.PCB deformation yog tshwm sim los ntawm Yin thiab Yang board tsim rau cov khoom hnyav.
b.PCB txhim kho BGA encapsulated Cheebtsam txais Yin thiab Yang phaj tsim, ua rau tsis ntseeg BGA solder pob qij txha
c.Cov phaj tshwj xeeb, tsis muaj kev sib dhos, tuaj yeem nkag mus rau cov khoom siv hauv ib txoj hauv kev uas yuav tsum tau siv cov cuab yeej thiab ua kom cov nqi tsim khoom.
d.Tag nrho plaub lub rooj sib tw splicing txais yuav txoj kev stamp qhov splicing, uas tsis muaj zog thiab yooj yim deformation.
Post lub sij hawm: Sep-10-2021