Advanced ntim yog ib qho ntawm cov txheej txheem tseem ceeb ntawm 'Ntau tshaj Moore' era.Raws li cov chips dhau los ua nyuaj thiab kim heev rau cov khoom siv me me ntawm txhua qhov txheej txheem, cov kws ua haujlwm tau muab ntau cov chips rau hauv cov pob khoom siab heev kom lawv tsis tas yuav tawm tsam kom txo lawv.Cov kab lus no muab cov lus qhia luv luv rau 10 ntawm cov ntsiab lus uas siv ntau tshaj plaws hauv kev ntim khoom.
2.5D pob
2.5D pob yog kev nce qib ntawm 2D IC ntim tshuab, uas tso cai rau cov kab zoo dua thiab siv qhov chaw.Nyob rau hauv ib pob 2.5D, liab qab tuag yog stacked los yog muab tso rau sab-los-sab saum toj ntawm ib txheej interposer nrog silicon ntawm vias (TSVs).Lub hauv paus, lossis txheej txheej interposer, muab kev sib txuas ntawm cov chips.
Lub pob 2.5D feem ntau yog siv rau high-end ASICs, FPGAs, GPUs thiab lub cim xeeb ntsuas.Xyoo 2008 pom Xilinx faib nws cov FPGAs loj rau hauv plaub qhov me me nrog cov txiaj ntsig siab dua thiab txuas cov no mus rau cov txheej txheem silicon interposer.2.5D pob khoom tau yug los thiab nws thiaj li tau siv dav rau kev sib koom ua ke ntawm kev nco siab bandwidth (HBM) processor.
Daim duab ntawm ib pob 2.5D
3D ntim
Nyob rau hauv ib pob 3D IC, logic tuag yog stacked ua ke los yog nrog cia tuag, tshem tawm qhov xav tau los tsim loj System-on-Chips (SoCs).Cov tuag tau txuas rau ib leeg los ntawm cov txheej txheem cuam tshuam, thaum 2.5D IC pob khoom siv cov khoom siv hluav taws xob lossis TSVs rau cov khoom sib txuas ntawm cov txheej txheem interposer, 3D IC pob khoom txuas ntau txheej ntawm silicon wafers rau cov khoom siv TSVs.
TSV thev naus laus zis yog qhov tseem ceeb siv thev naus laus zis hauv ob qho tib si 2.5D thiab 3D IC pob, thiab kev lag luam semiconductor tau siv HBM thev naus laus zis los tsim DRAM chips hauv 3D IC pob.
Ib qho kev pom ntawm 3D pob qhia tau hais tias txoj kev sib tshuam ntsug ntawm silicon chips tau ua tiav los ntawm cov hlau tooj liab TSVs.
Chiplet
Chiplets yog lwm hom 3D IC ntim khoom uas ua rau muaj kev sib koom ua ke ntawm CMOS thiab cov khoom tsis yog CMOS.Hauv lwm lo lus, lawv yog SoCs me, tseem hu ua chiplets, ntau dua li SoCs loj hauv ib pob.
Kev rhuav tshem SoC loj rau hauv me me, cov chips me me muab cov txiaj ntsig siab dua thiab cov nqi qis dua li ib leeg liab qab tuag.chiplets tso cai rau cov neeg tsim qauv coj kom zoo dua ntawm ntau yam IP yam tsis tas yuav xav txog cov txheej txheem ntawm kev siv thiab siv tshuab siv los tsim nws.Lawv tuaj yeem siv ntau yam khoom siv, suav nrog silicon, iav thiab laminates los tsim cov nti.
Chiplet-based systems yog tsim los ntawm ntau Chiplets ntawm ib txheej nruab nrab
Ntxuam Tawm Pob
Hauv pob Ntxuam Tawm, "kev sib txuas" yog kiv cua tawm ntawm lub nti kom muab ntau qhov I / O sab nraud.Nws siv cov khoom siv epoxy molding (EMC) uas tau muab tso rau hauv qhov tuag tag, tshem tawm qhov xav tau ntawm cov txheej txheem xws li wafer bumping, fluxing, flip-chip mounting, tu, hauv qab txau thiab kho.Yog li ntawd, tsis muaj txheej txheem intermediary yuav tsum yog, ua rau heterogeneous integration yooj yim dua.
Ntxuam tawm tshuab muaj ib pob me me nrog ntau I / O ntau dua li lwm hom pob, thiab hauv 2016 nws yog lub hnub qub thev naus laus zis thaum Apple tuaj yeem siv TSMC lub ntim tshuab los ua ke nws 16nm daim ntawv thov processor thiab mobile DRAM rau hauv ib pob rau iPhone. 7.
Ntxuam tawm ntim
Ntxuam tawm Wafer Level Ntim (FOWLP)
FOWLP thev naus laus zis yog kev txhim kho ntawm wafer-theem ntim (WLP) uas muab kev sib txuas sab nraud ntxiv rau cov chips silicon.Nws cuam tshuam nrog cov nti hauv cov khoom siv epoxy molding thiab tom qab ntawd tsim cov txheej txheem siab ceev rov ua dua tshiab (RDL) rau ntawm qhov chaw wafer thiab siv cov khoom siv los tsim cov wafer rov ua dua.
FOWLP muab ntau qhov kev sib txuas ntawm pob thiab daim ntawv thov board, thiab vim tias lub substrate loj dua qhov tuag, qhov tuag pitch yog tiag tiag ntau so.
Piv txwv ntawm FOWLP pob
Heterogeneous integration
Kev sib koom ua ke ntawm cov khoom sib txawv uas tsim tawm nyias rau hauv cov rooj sib txoos qib siab tuaj yeem txhim kho kev ua haujlwm thiab txhim kho kev ua haujlwm, yog li cov khoom siv semiconductor muaj peev xwm muab cov khoom siv sib txawv nrog cov txheej txheem sib txawv ntws mus rau hauv ib lub rooj sib txoos.
Heterogeneous integration yog zoo ib yam li system-in-pob (SiP), tab sis es tsis txhob combining ntau liab qab tuag ntawm ib tug substrate, nws combines ntau IPs nyob rau hauv daim ntawv ntawm Chiplets ntawm ib tug substrate.Lub tswv yim tseem ceeb ntawm kev sib koom ua ke heterogeneous yog muab ntau yam khoom sib txawv nrog cov haujlwm sib txawv hauv tib lub pob.
Qee qhov kev tsim vaj tsev blocks hauv kev sib koom ua ke heterogeneous
HBM
HBM yog cov txheej txheem txheej txheem khaws cia thev naus laus zis uas muab cov kab hluav taws xob siab rau cov ntaub ntawv hauv ib pawg thiab nruab nrab ntawm lub cim xeeb thiab cov khoom sib txuas.HBM pob khoom pawg nco tuag thiab txuas lawv ua ke ntawm TSV los tsim ntau I / O thiab bandwidth.
HBM yog JEDEC tus qauv uas txuas nrog ntau txheej txheej ntawm DRAM cov khoom hauv ib pob, nrog rau cov ntawv thov processors, GPUs thiab SoCs.HBM feem ntau yog siv los ua 2.5D pob rau high-end servers thiab networking chips.HBM2 tso tawm tam sim no hais txog lub peev xwm thiab lub moos txwv ntawm qhov pib HBM tso tawm.
HBM pob
Nruab nrab Txheej
Cov txheej txheem interposer yog cov khoom siv hluav taws xob uas cov teeb liab hluav taws xob tau dhau los ntawm ntau lub chip liab qab tuag lossis board hauv pob.Nws yog qhov hluav taws xob sib cuam tshuam ntawm lub qhov (sockets) lossis cov khoom sib txuas, tso cai rau cov teeb liab kom nthuav dav ntxiv mus thiab tseem txuas nrog lwm cov qhov (socket) ntawm lub rooj tsavxwm.
Cov txheej interposer tuaj yeem ua los ntawm cov khoom siv silicon thiab cov organic thiab ua tus choj ntawm ntau qhov tuag thiab lub rooj tsavxwm.Silicon interposer khaubncaws sab nraud povtseg yog ib tug pov thawj technology nrog siab zoo suab I / O ceev thiab TSV tsim muaj peev xwm thiab ua lub luag haujlwm tseem ceeb hauv 2.5D thiab 3D IC nti ntim.
Hom kev siv ntawm qhov system partitioned intermediate txheej
Rov faib txheej
Cov txheej txheej rov ua dua tshiab muaj cov tooj liab sib txuas lossis cov kev sib txuas uas ua kom muaj kev sib txuas hluav taws xob ntawm ntau qhov chaw ntawm pob.Nws yog ib txheej ntawm cov khoom siv hlau lossis polymeric dielectric uas tuaj yeem muab tso rau hauv pob nrog liab qab tuag, yog li txo qhov I / O qhov sib nrug ntawm cov chipsets loj.Cov khaubncaws sab nraud povtseg tau dhau los ua ib feem tseem ceeb ntawm 2.5D thiab 3D pob kev daws teeb meem, tso cai rau cov chips ntawm lawv sib txuas lus nrog ib leeg siv cov txheej txheem nruab nrab.
Cov pob khoom sib xyaw ua ke siv cov txheej txheem rov ua dua tshiab
TSV
TSV yog ib qho tseem ceeb siv thev naus laus zis rau 2.5D thiab 3D ntim cov kev daws teeb meem thiab yog tooj liab-filled wafer uas muab kev sib txuas ntsug los ntawm silicon wafer tuag.Nws khiav los ntawm tag nrho cov tuag los muab kev sib txuas hluav taws xob, tsim txoj kev luv tshaj plaws ntawm ib sab ntawm qhov tuag mus rau lwm qhov.
Los ntawm-qhov los yog vias yog etched rau ib qho tob ntawm sab pem hauv ntej ntawm lub wafer, uas yog ces insulated thiab sau los ntawm depositing ib tug conductive khoom (feem ntau tooj liab).Thaum lub nti yog fabricated, nws yog thinned los ntawm sab nraum qab ntawm lub wafer kom nthuav tawm cov vias thiab cov hlau tso rau sab nraum qab ntawm lub wafer kom tiav TSV interconnect.
Lub sij hawm xa tuaj: Plaub Hlis-07-2023