Substrate los yog nruab nrab txheej yog ib qho tseem ceeb heev ntawm BGA pob, uas yuav siv tau rau impedance tswj thiab inductor / resistor / capacitor kev koom ua ke ntxiv rau kev sib txuas xov.Yog li ntawd, cov khoom siv substrate yuav tsum muaj qhov kub hloov pauv iav rS (kwv yees li 175 ~ 230 ℃), siab ruaj khov thiab tsis muaj dej noo, kev ua haujlwm zoo hluav taws xob thiab kev ntseeg siab.Hlau zaj duab xis, rwb thaiv tsev txheej thiab substrate media yuav tsum muaj siab adhesion ntawm lawv.
1. Cov txheej txheem ntim ntawm cov hlau lead bonded PBGA
① Kev npaj ntawm PBGA substrate
Laminate tsis tshua muaj nyias (12 ~ 18μm tuab) tooj liab ntawv ci ntawm ob sab ntawm BT resin / iav core board, tom qab ntawd laum qhov thiab los ntawm lub qhov metallization.Cov txheej txheem PCB ntxiv rau 3232 yog siv los tsim cov duab ntawm ob sab ntawm lub substrate, xws li cov ntawv qhia strips, electrodes, thiab solder area arrays for mounting solder balls.Tom qab ntawd lub npog ntsej muag yog ntxiv thiab cov duab tsim los nthuav tawm cov electrodes thiab cov chaw solder.Txhawm rau txhim kho kev tsim khoom, lub substrate feem ntau muaj ntau PBG substrates.
② Ntim Txheej Txheem Flow
Wafer thinning → wafer txiav → chip bonding → plasma tu → lead bonding → plasma tu → molded pob → sib dhos ntawm cov khoom siv → reflow qhov cub soldering → nto kos → sib cais → zaum kawg tshuaj ntsuam → kuaj hopper ntim
Chip bonding siv nyiaj-filled epoxy nplaum rau daim ntawv cog lus IC nti rau hauv lub substrate, tom qab ntawd kub xaim kev sib txuas yog siv los paub txog kev sib txuas ntawm cov nti thiab cov substrate, ua raws li molded yas encapsulation los yog kua nplaum potting los tiv thaiv cov nti, solder kab. thiab pads.Lub cuab yeej tsim tshwj xeeb tuaj tos yog siv los tso cov pob 62/36/2Sn/Pb/Ag lossis 63/37/Sn/Pb nrog lub melting point ntawm 183 ° C thiab ib txoj kab uas hla ntawm 30 mil (0.75mm) ntawm lub pads, thiab reflow soldering yog ua nyob rau hauv ib tug pa reflow qhov cub, nrog ib tug siab tshaj plaws ua kub tsis ntau tshaj 230 ° C.Lub substrate yog ces centrifugally ntxuav nrog CFC inorganic cleaner kom tshem tawm cov solder thiab fiber ntau nyob rau hauv lub pob, ua raws li cov cim, kev sib cais, zaum kawg soj ntsuam, kuaj, thiab ntim rau cia.Cov saum toj no yog cov txheej txheem ntim ntawm cov hlau lead bonding hom PBGA.
2. Ntim txheej txheem ntawm FC-CBGA
① Ceramic substrate
Lub substrate ntawm FC-CBGA yog multilayer ceramic substrate, uas yog heev nyuaj rau ua.Vim hais tias lub substrate muaj kev sib txuas siab ceev, qhov sib nrug nqaim, thiab ntau dhau ntawm qhov, nrog rau qhov yuav tsum tau ntawm coplanarity ntawm lub substrate yog siab.Nws cov txheej txheem tseem ceeb yog: thawj zaug, cov nplooj ntawv ceramic multilayer yog sib koom ua ke ntawm qhov kub thiab txias los tsim cov txheej txheem multilayer ceramic metallized substrate, tom qab ntawd cov kab hlau sib txuas yog ua rau ntawm cov substrate, thiab tom qab ntawd plating yog ua, thiab lwm yam hauv kev sib dhos ntawm CBGA. , CTE mismatch ntawm substrate thiab nti thiab PCB pawg thawj coj saib yog qhov tseem ceeb ua rau tsis ua hauj lwm ntawm CBGA cov khoom.Txhawm rau txhim kho qhov teeb meem no, ntxiv rau CCGA qauv, lwm yam ceramic substrate, HITCE ceramic substrate, tuaj yeem siv.
② Cov txheej txheem ntim khoom ntws
Kev npaj ntawm disc pob -> disc txiav -> nti flip-flop thiab reflow soldering -> hauv qab filling ntawm thermal grease, faib ntawm sealing solder -> capping -> sib dhos ntawm cov pob solder -> reflow soldering -> cim -> sib cais -> kev soj ntsuam zaum kawg -> kuaj -> ntim
3. Cov txheej txheem ntim cov hlau lead TBGA
① TBGA daim kab xev
Cov cab kuj ntawm TBGA feem ntau yog ua los ntawm cov khoom siv polyimide.
Hauv kev tsim khoom, ob sab ntawm cov cab kuj yog thawj tooj liab coated, tom qab ntawd npib tsib xee thiab kub plated, tom qab ntawd los ntawm kev xuas nrig ntaus los ntawm lub qhov thiab los ntawm lub qhov metallization thiab tsim cov duab.Vim hais tias nyob rau hauv no cov hlau lead bonded TBGA, lub encapsulated kub dab dej kuj yog lub encapsulated ntxiv khoom thiab cov tub ntxhais kab noj hniav substrate ntawm lub raj plhaub, yog li cov cab kuj daim kab xev yog bonded rau lub tshav kub dab siv lub siab rhiab nplaum ua ntej encapsulation.
② Encapsulation txheej txheem ntws
Chip thinning → nti txiav → chip bonding → tu → lead bonding → plasma tu → kua sealant potting → sib dhos ntawm cov khoom siv → reflow soldering → deg marking → kev sib cais → kuaj zaum kawg → kuaj → ntim
Zhejiang NeoDen Technology Co., LTD., nrhiav tau nyob rau hauv 2010, yog ib tug kws chaw tsim tshuaj paus tshwj xeeb nyob rau hauv SMT xaiv thiab qhov chaw tshuab, reflow cub, stencil printing tshuab, SMT ntau lawm kab thiab lwm yam SMT khoom.
Peb ntseeg tias cov neeg zoo thiab cov neeg koom tes ua rau NeoDen yog ib lub tuam txhab zoo thiab tias peb txoj kev cog lus rau Innovation, Diversity thiab Sustainability kom ntseeg tau tias SMT automation yog siv tau rau txhua tus neeg nyiam nyiam nyob txhua qhov chaw.
Ntxiv: No.18, Tianzihu Avenue, Tianzihu Town, Anji County, Huzhou City, Zhejiang Province, Suav teb
Xov tooj: 86-571-26266266
Post lub sij hawm: Feb-09-2023