Cov khoom ntim khoom feem ntau muaj xws li txhuas deformation, puag offset, warpage, chip breakage, delamination, voids, ntim tsis sib xws, burrs, txawv teb chaws hais thiab tsis tiav curing, thiab lwm yam.
1. Lead deformation
Lead deformation feem ntau yog hais txog cov hlau lead los yog deformation tshwm sim thaum lub sij hawm ntws ntawm cov yas sealant, uas feem ntau yog qhia los ntawm qhov sib piv x / L ntawm qhov siab tshaj plaws lateral xaav x thiab qhov ntev ntawm cov hlau lead L. Lead bending tuaj yeem ua rau hluav taws xob luv (tshwj xeeb tshaj yog nyob rau hauv high density I / O ntaus pob khoom).Qee lub sij hawm cov kev ntxhov siab uas tsim los ntawm kev khoov tuaj yeem ua rau tawg ntawm qhov sib txuas los yog txo qis hauv daim ntawv cog lus.
Cov yam tseem ceeb uas cuam tshuam rau kev sib txuas ntawm cov hlau lead muaj xws li pob tsim, cov qauv txhuas, cov khoom siv lead ua thiab qhov loj me, cov khoom siv yas molding, cov txheej txheem txhuas txhuas, thiab cov txheej txheem ntim khoom.Lead parameters uas cuam tshuam rau cov hlau lead dabtsi yog khoov muaj xws li txhuas txoj kab uas hla, txhuas ntev, lead break load thiab txhuas density, thiab lwm yam.
2. Lub hauv paus offset
Base offset yog hais txog qhov deformation thiab offset ntawm cov cab kuj (chip puag) uas txhawb cov nti.
Cov yam ntxwv uas cuam tshuam rau lub hauv paus hloov pauv muaj xws li kev khiav ntawm cov molding compound, leadframe los ua ke tsim, thiab cov khoom siv ntawm molding compound thiab leadframe.Cov pob khoom xws li TSOP thiab TQFP yog qhov cuam tshuam rau lub hauv paus hloov thiab tus pin deformation vim lawv nyias nyias.
3. Warpage
Warpage yog qhov tawm ntawm lub dav hlau khoov thiab deformation ntawm lub pob khoom.Warpage tshwm sim los ntawm cov txheej txheem molding tuaj yeem ua rau muaj ntau yam teeb meem kev ntseeg siab xws li delamination thiab nti cracking.
Warpage kuj tseem tuaj yeem ua rau muaj ntau yam teeb meem tsim khoom, xws li hauv cov khoom siv yas pob kab sib chaws (PBGA), qhov twg warpage tuaj yeem ua rau tsis zoo ntawm cov pob zeb sib txuas, ua rau muaj teeb meem kev tso kawm thaum lub sij hawm rov qab ntawm cov cuab yeej rau kev sib dhos rau lub rooj tsav xwm luam tawm.
Warpage qauv muaj peb hom qauv: sab hauv concave, sab nraud convex thiab ua ke.Hauv cov tuam txhab semiconductor, concave qee zaum hu ua "smiley face" thiab convex li "cry face".Cov laj thawj tseem ceeb ntawm kev ua tsov rog suav nrog CTE mismatch thiab kho / compression shrinkage.Lub tom kawg tsis tau txais kev saib xyuas ntau thaum xub thawj, tab sis qhov kev tshawb fawb tob tau qhia tias cov tshuaj shrinkage ntawm cov molding compound kuj ua lub luag haujlwm tseem ceeb hauv IC ntaus ntawv warpage, tshwj xeeb tshaj yog nyob rau hauv cov pob ntawv nrog cov thicknesses sib txawv nyob rau sab saum toj thiab hauv qab ntawm cov nti.
Thaum lub sij hawm kho thiab tom qab kho cov txheej txheem, lub molding compound yuav undergo tshuaj shrinkage ntawm kub curing kub, uas yog hu ua "thermochemical shrinkage".Cov tshuaj shrinkage uas tshwm sim thaum kho tuaj yeem raug txo los ntawm kev ua kom cov iav hloov pauv kub thiab txo qhov kev hloov pauv ntawm coefficient ntawm thermal expansion ncig Tg.
Warpage kuj tuaj yeem tshwm sim los ntawm yam xws li cov khoom sib xyaw ntawm cov molding compound, ya raws hauv molding compound, thiab cov geometry ntawm pob.Los ntawm kev tswj cov khoom molding thiab muaj pes tsawg leeg, txheej txheem tsis, pob qauv thiab pre-encapsulation ib puag ncig, pob warpage tuaj yeem txo qis.Qee qhov xwm txheej, kev ua tsov rog tuaj yeem raug them nyiaj los ntawm encapsulating sab nraub qaum ntawm cov khoom siv hluav taws xob.Piv txwv li, yog tias cov kev sib txuas sab nraud ntawm lub rooj tsav xwm loj loj lossis cov rooj sib tham ntau txheej yog nyob rau tib sab, encapsulating lawv nyob rau sab nraub qaum tuaj yeem txo qhov kev sib ntaus sib tua.
4. Chip tawg
Cov kev ntxhov siab tsim tawm hauv cov txheej txheem ntim tuaj yeem ua rau nti tawg.Cov txheej txheem ntim khoom feem ntau aggravates micro-cracks tsim nyob rau hauv cov txheej txheem sib dhos dhau los.Wafer los yog chip thinning, backside sib tsoo, thiab chip bonding yog tag nrho cov kauj ruam uas yuav ua rau sprouting ntawm cov kab nrib pleb.
Lub chips tawg, mechanically ua tsis tau tejyam tsis tas yuav ua rau hluav taws xob tsis ua hauj lwm.Txawm hais tias lub chip tawg yuav ua rau hluav taws xob tsis ua hauj lwm tam sim ntawm lub cuab yeej kuj nyob ntawm txoj kev loj hlob tawg.Piv txwv li, yog tias qhov tawg tshwm nyob rau sab nraub qaum ntawm lub nti, nws yuav tsis cuam tshuam rau cov qauv rhiab heev.
Vim tias silicon wafers nyias thiab nkig, wafer-theem ntim yog qhov cuam tshuam rau cov nti tawg.Yog li ntawd, cov txheej txheem tsis xws li clamping siab thiab molding hloov siab nyob rau hauv cov txheej txheem molding yuav tsum nruj me ntsis tswj kom tsis txhob nti rupture.3D stacked pob khoom yog nquag nti rupture vim cov txheej txheem stacking.Cov qauv tsim cuam tshuam rau nti rupture nyob rau hauv 3D pob khoom xws li nti pawg qauv, substrate thickness, molding ntim thiab pwm lub tes tsho thickness, thiab lwm yam.
Post lub sij hawm: Feb-15-2023