5. Delamination
Delamination lossis kev sib txuas tsis zoo yog hais txog kev sib cais ntawm cov yas sealer thiab nws cov khoom siv sib txuas.Delamination tuaj yeem tshwm sim hauv txhua qhov chaw ntawm lub tshuab moulded microelectronic;Nws tuaj yeem tshwm sim thaum lub sij hawm encapsulation txheej txheem, tom qab-encapsulation manufacturing theem, los yog thaum lub sij hawm siv cov cuab yeej siv theem.
Kev sib txuas tsis zoo cuam tshuam los ntawm cov txheej txheem encapsulation yog qhov tseem ceeb hauv kev delamination.Interface voids, deg contamination thaum lub sij hawm encapsulation, thiab kev kho tsis tiav tuaj yeem ua rau muaj kev sib raug zoo tsis zoo.Lwm yam cuam tshuam muaj xws li shrinkage stress thiab warpage thaum kho thiab txias.Kev tsis sib haum ntawm CTE ntawm cov yas sealer thiab cov ntaub ntawv uas nyob ib sab thaum lub caij txias kuj tuaj yeem ua rau muaj kev ntxhov siab thermal-mechanical, uas tuaj yeem ua rau delamination.
6. Tsis muaj
Voids tuaj yeem tshwm sim ntawm txhua theem ntawm cov txheej txheem encapsulation, suav nrog kev hloov pauv molding, filling, potting, thiab luam ntawv ntawm molding compound rau hauv huab cua ib puag ncig.Voids tuaj yeem txo qis los ntawm kev txo qis ntawm huab cua, xws li khiav tawm lossis nqus.Lub tshuab nqus tsev siab xws li 1 txog 300 Torr (760 Torr rau ib qho chaw) tau tshaj tawm tias siv.
Kev tsom xam muab tub lim qhia tias nws yog kev sib cuag ntawm lub hauv qab yaj pem hauv ntej nrog lub nti uas ua rau cov ndlwg yuav raug cuam tshuam.Ib feem ntawm cov yaj pem hauv ntej ntws mus rau sab saud thiab sau rau saum ib nrab tuag los ntawm ib qho chaw qhib loj ntawm lub periphery ntawm nti.Cov tshiab tsim yaj pem hauv ntej thiab cov adsorbed yaj pem hauv ntej nkag mus rau sab saum toj ntawm ib nrab tuag, uas ua rau blistering.
7. Ntim tsis sib xws
Non-uniform pob thickness tuaj yeem ua rau warpage thiab delamination.Cov txheej txheem ntim cov tshuab, xws li hloov molding, siab molding, thiab infusion ntim thev naus laus zis, tsis tshua muaj peev xwm tsim cov khoom ntim nrog cov tuab tsis sib xws.Wafer-theem ntim yog tshwj xeeb tshaj yog raug rau qhov tsis sib xws plastisol thickness vim nws cov txheej txheem txheej txheem.
Txhawm rau kom ntseeg tau tias lub foob tuab tuab, lub wafer cab kuj yuav tsum tau kho nrog qhov qis qis kom pab txhawb nqa squeegee.Tsis tas li ntawd, squeegee txoj hauj lwm tswj yog yuav tsum tau ua kom ruaj khov squeegee siab kom tau ib tug uniform seal thickness.
Heterogeneous los yog inhomogeneous cov ntaub ntawv muaj pes tsawg leeg tuaj yeem ua rau thaum cov khoom muab tub lim sau hauv thaj chaw ntawm cov molding compound thiab tsim cov khoom tsis sib xws ua ntej hardening.Kev sib xyaw tsis txaus ntawm cov yas sealer yuav ua rau muaj qhov sib txawv ntawm qhov zoo hauv cov txheej txheem encapsulation thiab potting.
8. Raw ntug
Burrs yog cov yas molded uas dhau los ntawm txoj kab sib faib thiab muab tso rau ntawm cov cuab yeej pins thaum lub sij hawm molding txheej txheem.
Tsis txaus clamping siab yog lub ntsiab ua rau burrs.Yog tias cov khoom siv molded residue ntawm cov pins tsis raug tshem tawm hauv lub sijhawm, nws yuav ua rau muaj ntau yam teeb meem hauv kev sib dhos.Piv txwv li, kev sib txuas tsis txaus lossis adhesion nyob rau theem tom ntej ntim.Resin leakage yog daim ntawv thinner ntawm burrs.
9. Cov khoom txawv teb chaws
Nyob rau hauv cov txheej txheem ntim, yog tias cov khoom ntim raug cuam tshuam rau ib puag ncig, cov khoom siv lossis cov khoom siv, cov khoom txawv teb chaws yuav kis tau rau hauv pob thiab sau rau ntawm cov khoom hlau hauv pob (xws li IC chips thiab cov ntsiab lus sib txuas), ua rau corrosion thiab lwm yam. teeb meem kev ntseeg tom qab.
10. Kev kho tsis tiav
Lub sij hawm kho tsis txaus lossis qhov kub tsis zoo tuaj yeem ua rau kev kho tsis tiav.Tsis tas li ntawd, kev hloov me ntsis hauv qhov sib xyaw ntawm ob lub encapsulants yuav ua rau kev kho tsis tiav.Txhawm rau kom ua tiav cov khoom ntawm lub encapsulant, nws yog ib qho tseem ceeb kom paub meej tias lub encapsulant tau kho tag nrho.Hauv ntau txoj kev encapsulation, kev kho tom qab raug tso cai los ua kom tiav kev kho mob ntawm encapsulant.Thiab kev saib xyuas yuav tsum tau ua kom ntseeg tau tias cov khoom siv encapsulant tau raug faib ua kom raug.
Post lub sij hawm: Feb-15-2023