Taw qhia rau PCB substrate

Classification ntawm substrate

Cov ntaub ntawv luam tawm dav dav hauv substrate tuaj yeem muab faib ua ob pawg: cov ntaub ntawv tsis sib xws thiab cov ntaub ntawv yooj yim substrate.Ib qho tseem ceeb ntawm cov khoom siv tsis sib xws yog tooj liab clad laminate.Nws yog ua los ntawm cov khoom siv Reinforeing, impregnated nrog resin binder, qhuav, txiav thiab laminated rau hauv qhov dawb paug, ces them nrog tooj liab ntawv ci, siv cov ntawv hlau ua pwm, thiab ua tiav los ntawm qhov kub thiab txias hauv kev kub xovxwm.General multilayer semi-kho daim ntawv, yog tooj liab clad nyob rau hauv cov txheej txheem ntawm cov khoom semi-tiav lawm (feem ntau iav ntaub soaked nyob rau hauv resin, los ntawm qhuav ua).

Muaj ntau yam kev faib tawm rau tooj liab clad laminate.Feem ntau, raws li cov ntaub ntawv sib txawv ntawm lub rooj tsavxwm, nws tuaj yeem muab faib ua tsib pawg: daim ntawv puag, iav fiber ntau daim ntaub puag, sib xyaw puag (CEM series), laminated multilayer board puag thiab cov khoom tshwj xeeb puag (ceramics, hlau core puag, lwm yam).Yog tias lub rooj tsavxwm siv los ntawm cov nplaum nplaum sib txawv rau kev faib tawm, cov ntawv sib txawv - raws li CCI.Muaj: phenolic resin (XPc, XxxPC, FR 1, FR 2, thiab lwm yam), epoxy resin (FE 3), polyester resin thiab lwm yam.Feem ntau CCL yog epoxy resin (FR-4, FR-5), uas yog hom iav fiber ntau siv ntau tshaj plaws.Tsis tas li ntawd, muaj lwm cov resins tshwj xeeb (iav fiber ntau daim ntaub, polyamide fiber ntau, tsis-woven daim ntaub, thiab lwm yam, raws li cov ntaub ntawv ntxiv): bismaleimide hloov trizine resin (BT), polyimide resin (PI), diphenyl ether resin (PPO), txiv neej anhydride imide - styrene resin (MS), polycyanate ester resin, polyolefin resin, thiab lwm yam.

Raws li cov nplaim retardant kev ua tau zoo ntawm CCL, nws tuaj yeem muab faib ua cov nplaim hluav taws xob (UL94-VO, UL94-V1) thiab hom tsis nplaim hluav taws (Ul94-HB).Hauv 12 xyoo dhau los, raws li kev saib xyuas ntau dua rau kev tiv thaiv ib puag ncig, ib yam tshiab ntawm nplaim taws-retardant CCL yam tsis muaj bromine tau raug cais tawm, uas tuaj yeem hu ua "ntsuab nplaim taws-retardant CCL".Nrog rau kev loj hlob sai ntawm cov khoom siv hluav taws xob, cCL muaj kev ua tau zoo dua.Yog li ntawd, los ntawm CCL kev faib tawm, thiab muab faib ua kev ua haujlwm dav dav CCL, qis dielectric tas li CCL, siab kub tsis kam CCL (cov phaj dav dav L hauv 150 ℃ saum toj no), qis thermal expansion coefficient CCL (feem ntau siv rau ntawm lub ntim substrate) thiab lwm yam. .

 

Txuj kev siv substrate

Nrog rau kev txhim kho thiab kev nce qib ntawm kev siv tshuab hluav taws xob tsis tu ncua, cov kev xav tau tshiab tau muab tso rau yav tom ntej rau cov ntaub ntawv luam tawm cov ntaub ntawv substrate, txhawm rau txhawb kev txhim kho txuas ntxiv ntawm tooj liab clad phaj qauv.Tam sim no, cov qauv tseem ceeb rau cov khoom siv substrate yog raws li hauv qab no.
1) National Standards for Substrates Tam sim no, Lub teb chaws tus qauv rau substrates nyob rau hauv Tuam Tshoj muaj xws li GB / T4721 - 4722 1992 thiab GB 4723 - 4725 - 1992. Tus qauv rau tooj liab clad laminates nyob rau hauv Taiwan cheeb tsam ntawm Tuam Tshoj yog CNS tus qauv, uas yog raws li ntawm Japanese JIs tus qauv thiab tau tshaj tawm xyoo 1983.

Nrog rau kev txhim kho thiab kev nce qib ntawm kev siv tshuab hluav taws xob tsis tu ncua, cov kev xav tau tshiab tau muab tso rau yav tom ntej rau cov ntaub ntawv luam tawm cov ntaub ntawv substrate, txhawm rau txhawb kev txhim kho txuas ntxiv ntawm tooj liab clad phaj qauv.Tam sim no, cov qauv tseem ceeb rau cov khoom siv substrate yog raws li hauv qab no.
1) National Standards for Substrates Tam sim no, Tuam Tshoj lub teb chaws tus qauv rau substrates muaj xws li GB/T4721 — 4722 1992 thiab GB 4723 — 4725 — 1992. Tus qauv rau tooj liab clad laminates nyob rau hauv Taiwan cheeb tsam ntawm Tuam Tshoj yog CNS tus qauv, uas yog raws li nyob rau hauv lub Japanese JIs tus qauv thiab tau tshaj tawm xyoo 1983.
2) Lwm cov qauv hauv tebchaws suav nrog Japanese JIS tus qauv, American ASTM, NEMA, MIL, IPc, ANSI thiab UL tus qauv, British Bs tus qauv, German DIN thiab VDE tus qauv, Fabkis NFC thiab UTE tus qauv, Canadian CSA tus qauv, Australian AS tus qauv, FOCT tus qauv ntawm yav dhau los Soviet Union, thiab thoob ntiaj teb tus qauv IEC

Lub teb chaws tus txheej txheem lub npe cov txheej txheem yog xa mus rau raws li lub tuam tsev ntawm tus txheej txheem lub npe formulation
JIS-Japanese Industrial Standard - Nyiv Specification Association
ASTM-American Society for Laboratory Materials Standards -American Society fof Testi 'ng thiab Cov Khoom Siv
NEMA- National Association of Electrical Manufactures Standard - Nafiomll Electrical Manufactures
MH- Teb Chaws Mis Kas Cov Qauv Tub Rog -Department of Defense Military Specific Tions and Standards
IPC- American Circuit Interconnection thiab Ntim Association Standard -Lub lim tiam muaj tseeb rau Interoonnecting thiab Packing EIectronics Circuits
ANSl- American National Standard Institute


Post lub sij hawm: Dec-04-2020

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